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Dendritic cooling layers for printed circuit boards and method of fabrication thereof. The dendritic cooling layers may have non-intuitive dendritic structures that minimize peak temperature. The dendritic cooling layers may also be compatible with current PCB fabrication techniques. The dendritic cooling layers may have an adjustable tolerance to meet fabrication limits. The current invention also contemplates a method of generating a dendritic high conductivity path suitable for printed circuit boards. The methodology comprises the replacement of low conductivity materials with high conductivity materials such that the optimal ratio can be obtained to minimize heat flow resistance, while also maintaining lower costs of production.